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<div>Objectives 1 paragraph
<br></div><div>In this lab our objective was to create a study ………. by use of lithography.
<br></div><div>A wafer was prepared for this lab prior, it was composed of a thin layer of Titanium (20
<br></div><div>nanometer) with a thicker layer of Aluminum (200 nanometer) on top. Our goal in this lab was to
<br></div><div>take this wafer with thin Aluminum/Titanium film, and imprint the design of the thermal sensor
<br></div><div>on it using a mask. After etching the excess Al and Ti away, we should be left with only the
<br></div><div>sensor. We will continue to elaborate on the steps we completed in this lab and their purpose.
<br></div><div>First, we will provide background information on different applications for thermal sensors and
<br></div><div>how they are created.
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>background and motivation of the lab
<br></div><div>Photolithography
<br></div><div>Photolithography is defined as transferring patterns on a mask to the surface of the silicon
<br></div><div><br></div><div>wafer. Alois Senefelder, around 1978 in Germany, was the first one who accidentally discovered
<br></div><div><br></div><div>a way to copy scripts onto limestone, called “writing on stone”. A clean impression of the design
<br></div><div><br></div><div>was made when a sheet of paper was pressed against the surface of the stone. After then, a lot of
<br></div><div><br></div><div>research was conducted, both in industrial and academic level, to develop such a technique [2].
<br></div><div><br></div><div>Among industrial companies, Kasper instruments and Nikon was the first to develop lithography
<br></div><div><br></div><div>technique.
<br></div><div><br></div><div>Generally speaking, lithography can be divided into eight main steps: Wafer cleaning,
<br></div><div><br></div><div>prebake, adhesion promotion, photoresist application, soft bake, UV exposure, development and
<br></div><div><br></div><div>hard bake. Figure 1 shows the schematic steps in a typical photolithography process.
<br></div><div><br></div><div>Photolithography is one of the important steps in semiconductor manufacturing since it
<br></div><div><br></div><div>directly affects other fabrication steps especially etching process.
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Background (or Principles) 1-3 pages
<br></div><div><br></div><div><br></div><div>Introduce the operational principles of the technology or equipment
<br></div><div><br></div><div><br></div><div><br></div><div>Describe the process and explain the theories
<br></div><div><br></div><div><br></div><div>Cite the references from other publications and resources 2.0 Procedure 1-2 pages
<br></div><div><br></div><div>Procedure:
<br></div><div><br></div><div><br></div><div>Elaborate on steps performed in lab
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Define equipment and/or materials used
<br></div><div><br></div><div><br></div><div><br></div><div>Give all necessary equations
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Results and Discussion 2-5 pages
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Explain the experimental results
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Show and explain all necessary data, pictures, tables, and graphs with proper titles, axis titles, legends, etc.
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Evaluate results and comment on their accuracy
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Evaluate microfabrication processes consider environment factors
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Read references and compare your data with existing theories or data
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Cite the references from other publications and resources 3.0
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>Conclusions 1 paragraph Summarize the findings 1.0
<br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div><br></div><div>References Use the IEEE standard reference format
<br></div>