Conclusion

We demonstrate the flip-chip bonding of VCSEL with silicon photonics chips. A 2 x 4 VCSEL array has been successfully bonded to a silicon photonics chip with silicon dioxide cladding. A bidirectional vertical grating coupler is designed to couple the light from the VCSEL onto the silicon photonics chip. The bonded VCSEL has been driven using the electrodes on the silicon photonics chip and the corresponding LIV curves have been obtained.