Iloss is minimized as there is less than 1.5dB loss per facet compared to 7dB in butt coupling and 3dB in fibre packaging [1]. This wirebond will be fabricated as a single silicon photonic chip 
The layout shown in Fig. 1. 
The design objective of this laser is to make a single-mode laser with target wavelength of 1550nm, with good wall-plug efficiency.  The design is first made in klayout to check for fabrication issues that may prevent design to be made; then simulations were run on Lumerical INTERCONNECT to verify the performance of the final design. 
The chosen RSOA chip was a SAF1126 InP active waveguide gain element.