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Achieving high-quality nano-silver joints for high-reliability power electronics via pressureless sintering
  • +4
  • Chenyi Dai,
  • Yong Wang,
  • Pengrong Lin,
  • Zilin Hao,
  • Chaoyang Wang,
  • Xiaocheng Feng,
  • Xueming Liu
Chenyi Dai
Beijing Microelectronic Technology Institute
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Yong Wang
Beijing Microelectronic Technology Institute
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Pengrong Lin
Beijing Microelectronic Technology Institute
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Zilin Hao
Beijing Microelectronic Technology Institute

Corresponding Author:[email protected]

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Chaoyang Wang
Beijing Microelectronic Technology Institute
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Xiaocheng Feng
Beijing Microelectronic Technology Institute
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Xueming Liu
Beijing Microelectronic Technology Institute
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Abstract

The fabrication of nano-silver joints was done using the pressureless sintering technology to suit the demand of high-power electronics. Porosity of 10.6% and shear strength of 39.6 MPa were reached under the optimized parameters of 300℃ sintering temperature and 45 min residence time. The sintered joint demonstrated good mechanical/thermal/electrical performance in reliability testing, including the temperature cycling test, second sintering test, steady-state lifetime test, and intermittent lifetime test. This study demonstrated the viability of pressureless sintering of nano-silver joints with good high-temperature reliability, which has significant application potential for aeronautical power electronics.