Achieving high-quality nano-silver joints for high-reliability power
electronics via pressureless sintering
The fabrication of nano-silver joints was done using the pressureless
sintering technology to suit the demand of high-power electronics.
Porosity of 10.6% and shear strength of 39.6 MPa were reached under the
optimized parameters of 300℃ sintering temperature and 45 min residence
time. The sintered joint demonstrated good mechanical/thermal/electrical
performance in reliability testing, including the temperature cycling
test, second sintering test, steady-state lifetime test, and
intermittent lifetime test. This study demonstrated the viability of
pressureless sintering of nano-silver joints with good high-temperature
reliability, which has significant application potential for
aeronautical power electronics.