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Temperature-dependent fatigue modeling of a novel Ni, Bi, Sb containing Sn-3.8Ag-0.7Cu lead-free solder alloy
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  • Bang Tao,
  • L. Benabou,
  • Van Nhat Le,
  • Ngoc Anh Thi Nguyen,
  • Hung Nguyen
Bang Tao
Danang University of Science and Technology

Corresponding Author:tqbang@dut.udn.vn

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L. Benabou
Univ Versailles St Quentin En Yvelines UVSQ
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Van Nhat Le
2LISV, Université de Versailles Saint-Quentin-en-Yvelines, University Paris-Saclay
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Ngoc Anh Thi Nguyen
Danang university of science and education
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Hung Nguyen
Ho Chi Minh City University of Technology
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Low-cycle fatigue testing of a lead-free solder (InnoLot) based on Sn-3.8Ag-0.7Cu (SAC387) with three simultaneous additions of bismuth, nickel and antimony was conducted using miniature-sized fatigue specimens at different temperatures and strain amplitudes. The experiments show a decline of the load capacity of the solder alloy with the number of loading cycles. The fatigue life of the solder is also decreased by the level of imposed temperature. The modified Coffin-Manson and Morrow models were used to analyze the behavior under fatigue and predict lifetime. The parameters in the two fatigue models which were determined by considering different temperatures and total strain amplitudes. Compared to other reference lead-free solders, the InnoLot solder shows much better fatigue strength. The better fatigue strength is found to result from the effect of BiNiSb elements. Also, lifetime predictions were made with both models for the solder alloy under different conditions.
04 Apr 2020Submitted to Fatigue & Fracture of Engineering Materials & Structures
04 Apr 2020Submission Checks Completed
04 Apr 2020Assigned to Editor
10 Apr 2020Reviewer(s) Assigned
23 May 2020Review(s) Completed, Editorial Evaluation Pending
29 May 2020Editorial Decision: Revise Major
24 Jun 20201st Revision Received
25 Jun 2020Submission Checks Completed
25 Jun 2020Assigned to Editor
26 Jun 2020Reviewer(s) Assigned
11 Jul 2020Review(s) Completed, Editorial Evaluation Pending
15 Jul 2020Editorial Decision: Accept